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Cadence Products

IC Design Tools

Cadence's Integrated Circuit (IC) tools cover the complete front-end and back-end design flow, from schematic capture to physical implementation and verification. These tools support custom analog/mixed-signal (AMS) and digital IC design, including thermal analysis to optimize power efficiency.

Key Tools

  • Virtuoso Platform – Industry-leading solution for custom and analog IC design, including schematic capture, layout, and simulation
  • Innovus Implementation System – A powerful place-and-route tool for digital ICs, supporting advanced FinFET nodes
  • Genus Synthesis Solution – High-performance logic synthesis tool with AI-driven optimization
  • Tempus Timing Signoff – Industry-standard Static Timing Analysis (STA) and signoff solution
  • Voltus IC Power Integrity Solution – Analyzes IR drop and power integrity for IC designs
  • Celsius Thermal Solver – Provides electrothermal co-simulation, crucial for chip-package-PCB thermal analysis
  • Thermal Analysis - Celsius Thermal Solver integrates with Voltus for accurate power-thermal co-simulation, helping to identify and mitigate thermal hotspots in advanced-node designs
ic design
PCB Design Tool

PCB Design Tools

Cadence offers high-performance PCB design tools with capabilities for schematic capture, layout, signal integrity, power integrity, and manufacturability analysis. These tools are widely used in high-speed, high-density designs for applications such as 5G, AI, and automotive electronics.

Key Tools

  • Allegro PCB Designer – Industry-standard PCB design tool with constraint-driven routing for complex boards.
  • OrCAD PCB Designer – Cost-effective PCB design tool for mid-range and entry-level applications.
  • Sigrity PowerSI & SI – Signal Integrity (SI) and Power Integrity (PI) analysis tools for high-speed designs.
  • Clarity 3D Solver – Advanced 3D electromagnetic solver for PCB and package design.
  • DesignTrue DFM – Design for Manufacturing (DFM) checks to ensure manufacturability.
  • Integration - Cadence’s Allegro + Sigrity + Clarity suite provides a comprehensive PCB design and verification flow, ensuring high-speed performance and reliability.

Packaging Tools

With the rise of chiplet-based architectures and advanced packaging, Cadence provides tools for 2.5D/3D IC packaging and heterogeneous integration.

Key Tools

  • Allegro Package Designer Plus – Enables advanced package layout, including wire bonding, flip-chip, and fan-out designs.
  • Virtuoso System Design Platform – Supports IC-package-PCB co-design for optimized performance.
  • Sigrity X – Provides power and signal integrity analysis for multi-die and package designs.
  • Clarity 3D Solver – Enables full-wave 3D electromagnetic (EM) analysis for package interconnects.
  • Heterogeneous Integration - These tools help optimize 2.5D and 3D-IC packaging for high-performance computing (HPC), AI, and networking applications.
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cadence data center

Data Center Solutions

Cadence offers cloud-based EDA solutions and AI-powered design tools to accelerate semiconductor and PCB design cycles.

Key Tools

  • CloudBurst Platform – Provides on-demand EDA cloud computing, reducing design cycle times.
  • Cadence Managed Cloud – A secure, cloud-hosted EDA environment for large-scale semiconductor projects.
  • Machine Learning (ML) in EDA – AI-powered design convergence, power reduction, and optimization for IC and PCB design.
  • Scalability - These solutions ensure secure, high-performance computing to handle complex multi-physics and multi-die simulations.

Computational Fluid Dynamics (CFD) Tools

Cadence provides advanced Computational Fluid Dynamics (CFD) tools for applications such as electronics cooling, aerodynamics, and multi-physics simulations.

Key Tools

  • Omnis CFD – A full-featured CFD solver for fluid dynamics, combustion, and turbomachinery.
  • Fidelity CFD – High-fidelity CFD simulation for aerospace, automotive, and thermal management applications.
  • Celsius Thermal Solver – Enables chip-package-system thermal analysis, including air and liquid cooling.
cadence data center