Cadence's Integrated Circuit (IC) tools cover the complete front-end and back-end design flow, from schematic capture to physical implementation and verification. These tools support custom analog/mixed-signal (AMS) and digital IC design, including thermal analysis to optimize power efficiency.
With the rise of chiplet-based architectures and advanced packaging, Cadence provides tools for 2.5D/3D IC packaging and heterogeneous integration.
Cadence offers high-performance PCB design tools with capabilities for schematic capture, layout, signal integrity, power integrity, and manufacturability analysis. These tools are widely used in high-speed, high-density designs for applications such as 5G, AI, and automotive electronics.
Cadence provides advanced Computational Fluid Dynamics (CFD) tools for applications such as electronics cooling, aerodynamics, and multi-physics simulations.
Designing data centers requires CFD simulation to accurately predict airflow, temperature distribution, and cooling efficiency. This ensures optimal thermal management, preventing hotspots and reducing energy consumption