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As AI systems become more powerful, the complexity of designing the systems that connect, power, and cool them continues to grow. Engineering teams today face increasing challenges balancing electrical, thermal, mechanical, manufacturing, and supply-chain constraints across PCB and advanced packaging workflows. These challenges are becoming critical bottlenecks to innovation and time-to-market. Date: Tuesday, August 18, 2026 Join Cadence for an exclusive webinar exploring how AuraStack™ AI Super Agent applies agentic AI, accelerated Multiphysics, and EDA design solutions to help teams reason across design tradeoffs, continuously optimize performance, and accelerate system realization. Reserve your spot today.
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