Proper HDI design is critical for meeting the demands of today’s compact, high-performance electronics. From managing layer stackups to routing fine-pitch BGAs, every decision impacts your design’s manufacturability and reliability.

Webinar: HDI Design Workflow: From Decisions to Fabrication

Get the live webinar Recordings of Kirsch Mackey, where he covered the following:

• How to architect effective layer stackups for HDI designs.
• Techniques for fine-pitch BGA breakout routing.
• In-tool DFM validation to ensure fabrication success.

Kirsch demonstrated these techniques using NVIDIA Jetson-based carrier board and gave practical insights for direct application to projects.

Missed the Live Session?

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