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Proper HDI design is critical for meeting the demands of today’s compact, high-performance electronics. From managing layer stackups to routing fine-pitch BGAs, every decision impacts your design’s manufacturability and reliability.

Live Webinar: HDI Design Workflow: From Decisions to Fabrication

Date:Wednesday, April 22, 2026
Time: 8:30 PM — 9:30 PM IST

Join us for a live webinar with Kirsch Mackey, where he will cover the following:

  • How to architect effective layer stackups for HDI designs.
  • Techniques for fine-pitch BGA breakout routing.
  • In-tool DFM validation to ensure fabrication success.

Kirsch will demonstrate these techniques using a NVIDIA Jetson-based carrier board, giving you practical insights to apply directly to your projects.

Reserve your spot today and get your questions answered during the live Q&A.

Register Now

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