|
Proper HDI design is critical for meeting the demands of today’s compact, high-performance electronics. From managing layer stackups to routing fine-pitch BGAs, every decision impacts your design’s manufacturability and reliability.
Live Webinar: HDI Design Workflow: From Decisions to Fabrication
Date:Wednesday, April 22, 2026
Time: 8:30 PM — 9:30 PM IST
Join us for a live webinar with Kirsch Mackey, where he will cover the following:
- How to architect effective layer stackups for HDI designs.
- Techniques for fine-pitch BGA breakout routing.
- In-tool DFM validation to ensure fabrication success.
Kirsch will demonstrate these techniques using a NVIDIA Jetson-based carrier board, giving you practical insights to apply directly to your projects.
Reserve your spot today and get your questions answered during the live Q&A.
|